The race of integrated-circuit technology towards high bit density has already brought transistor densities of the order of 109 cm-2, while keeping conventional circuit layouts. Crossbar structures are widely believed to meet the requirements of high bit density along with sustainable interconnection complexity avoiding the dramatic cost increase of the manufacturing facilities

Terascale integration via a redesign of the crossbar based on a vertical arrangement of poly-Si nanowires

Ferri M;Veronese GP;Solmi S;
2010

Abstract

The race of integrated-circuit technology towards high bit density has already brought transistor densities of the order of 109 cm-2, while keeping conventional circuit layouts. Crossbar structures are widely believed to meet the requirements of high bit density along with sustainable interconnection complexity avoiding the dramatic cost increase of the manufacturing facilities
2010
Istituto per la Microelettronica e Microsistemi - IMM
Inglese
25
095011
095017
7
Sì, ma tipo non specificato
SILICON
NANOELECTRONICS
FABRICATION
MEDICINE
ARRAYS
3
info:eu-repo/semantics/article
262
Cerofolini GF; Ferri M; Romano E; Suriano F; Veronese GP; Solmi S; Narducci D
01 Contributo su Rivista::01.01 Articolo in rivista
none
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/436398
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