Transient-Liquid-Phase Bonding of UHTCs Using Refractory-Metal-Based Interlayers for High-Efficiency Energy-Generation Applications (Mid.term Report RT-2013/81)

Bilateral project between CNR ISTEC and Kyushu University, Fukuoka Japan. 1. Extension of TLP bonding methods to allow the rapid, reliable fabrication of robust joints involving UHTCs, and thus, exploiting the full use of their unique properties in a wide range of applications. 2. Enabling the introduction of UHTCs in both energy-generating and energy-consuming systems at higher temperatures, increasing conversion efficiencies and potentially decreasing emissions. 3. Establishing the relationship between the diffusivity-solubility product of the liquid former, the interlayer design, and the isothermal solidification time. 4. Enhance of the understanding of TLP bonding. 5. Facilitate identification of viable interlayers for joining a wider range of UHTCs. 6. Allowing engineers to take full advantage of UHTCs by means of TLP bonding, while minimizing overall production costs, in contrast to currently available conventional bonding methods for ceramics. 7. Establishing a reliable joining method to promote wider use of UHTCs, providing an avenue for quickly improving existing designs, and for developing new designs with significantly better performance. 8. Increasing efficiencies in clean energy-generation applications.