IMPRONTA, MAURIZIO PIO
IMPRONTA, MAURIZIO PIO
Istituto per la Microelettronica e Microsistemi - IMM
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Risultati 1 - 6 di 6 (tempo di esecuzione: 0.006 secondi).
Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach
2007 Impronta, M; Marras, A; De Munari, I; Scorzoni, A; Valentini, Mg
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests
2007 Marras A; Impronta M; De Munari I; Valentini MG; Scorzoni A
An improved isothermal electromigration test for Cu-damascene characterization
2004 Impronta, M; Farris, S; Scorzoni, A
Wide-band modelling of CMOS interconnections and voiding damages with the lumped element LE-FDTD method
2004 Alimenti F.; Impronta M.; Scorzoni A.; Roselli L.
Are high resolution resistometric methods really useful for the early detection of electromigration damage?
1997 A Scorzoni; S Franceschini; R Balboni; M Impronta; I De Munari; F Fantini
RAPID ISOTHERMAL ANNEALING OF ION IMPLANTED SILICON DEVICES BY UNIFORM LARGE AREA IRRADIATION WITH A NEW ELECTRON BEAM SYSTEM.
1983 Dori, Leonello; Impronta, Maurizio; Lulli, Giorgio; Merli, Pier Giorgio; Severi, Maurizio