The use of metallorganic decomposition for the preparation of polymeric-ceramic precursors has been object of considerable interest. A method used to deposit films on alumina by Ryder et al. has been used to put down a barium hexaferrite film on silicon with an appropriate adhesion layer ( Zr02). The thicknesses of the films were 0.25 11m per spun-on layer. A magnetic and morphological characterization of the films indicates that the best heat treatment after deposition consists of a pyrolysis of the organic constituents at 400 °C followed by crystallization of the hexaferrite at 700 °C. If an oxygen atmosphere was during the crystallization the grain size decreased and the coercive field increased

Thin films of hexagonal ferrites on Si prepared using MOD processing

BE Watts;E Melioli;
1995

Abstract

The use of metallorganic decomposition for the preparation of polymeric-ceramic precursors has been object of considerable interest. A method used to deposit films on alumina by Ryder et al. has been used to put down a barium hexaferrite film on silicon with an appropriate adhesion layer ( Zr02). The thicknesses of the films were 0.25 11m per spun-on layer. A magnetic and morphological characterization of the films indicates that the best heat treatment after deposition consists of a pyrolysis of the organic constituents at 400 °C followed by crystallization of the hexaferrite at 700 °C. If an oxygen atmosphere was during the crystallization the grain size decreased and the coercive field increased
1995
Inglese
World Ceramics Congress, part of the 8th CIMTEC-World Ceramics Congress and Forum on New Materials
2677
2683
8886538022
Techna Group
Faenza
ITALIA
Sì, ma tipo non specificato
June 28-July 4, 1994
Florence, Italy
2
none
B.E. Watts; F. Leccabue; R. Panizzieri; E. Melioli; S.Díaz; H. Rodríguez;J.L. Sánchez
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/127084
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