Films of chalcogenide Ge-Sb-Te materials were grown by pulsed liquid injection chemical vapor deposition (CVD) technique. Simple thermal CVD without additional process activation and CVD with remote activation of precursor decomposition process by a hot-wire were investigated and compared. Ge(NMe2)(4), Sb(NMe2)(3) and Te(i-Pr)(2) precursors in a form of diluted solutions in toluene were used for depositions. Film composition was controlled by injection parameters, while the thickness was directly related with number of pulses. Hot-wire activated CVD process allows the growth of chalcogenide films of clearly better quality compared to films grown by standard thermal CVD. Uniform, smooth, crystalline Ge2Sb2Te5 films were grown at substrate/wire temperature 300 degrees C/550 degrees C and pressure <= 15 Torr, using nitrogen as a carrier gas, on Si, Si/SiO2, Si/Si3N4 and glass substrates. Forty to forty five nanometer thick films on Si/SiO2 substrates showed reversible electrical and optical phase switching behavior. (C) 2008 Elsevier B.V. All rights reserved.
Chemical vapor deposition of chalcogenide materials for phase-change memories
Wiemer C;Longo M;
2008
Abstract
Films of chalcogenide Ge-Sb-Te materials were grown by pulsed liquid injection chemical vapor deposition (CVD) technique. Simple thermal CVD without additional process activation and CVD with remote activation of precursor decomposition process by a hot-wire were investigated and compared. Ge(NMe2)(4), Sb(NMe2)(3) and Te(i-Pr)(2) precursors in a form of diluted solutions in toluene were used for depositions. Film composition was controlled by injection parameters, while the thickness was directly related with number of pulses. Hot-wire activated CVD process allows the growth of chalcogenide films of clearly better quality compared to films grown by standard thermal CVD. Uniform, smooth, crystalline Ge2Sb2Te5 films were grown at substrate/wire temperature 300 degrees C/550 degrees C and pressure <= 15 Torr, using nitrogen as a carrier gas, on Si, Si/SiO2, Si/Si3N4 and glass substrates. Forty to forty five nanometer thick films on Si/SiO2 substrates showed reversible electrical and optical phase switching behavior. (C) 2008 Elsevier B.V. All rights reserved.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
