Polycrystalline silicon thin-film transistors (TFTs) have been fabricated by using a combined fast solid-phase crystallization (SPC) process followed by excimer laser annealing (ELA). The electrical characteristics of the devices, after post-hydrogenation, show average field effect mobilities > 100 cm2/Vs and better noise performance, if compared to conventional SPC-polysilicon TFTs. A main advantage of the presented technique is the reduced sensitivity of the device performances to the energy density used during ELA.

Combined Solid Phase Crystallization and Excimer Laser Annealing Process for Polysilicon Thin-Film Transistors

A Pecora;L Mariucci;G Fortunato;
1998

Abstract

Polycrystalline silicon thin-film transistors (TFTs) have been fabricated by using a combined fast solid-phase crystallization (SPC) process followed by excimer laser annealing (ELA). The electrical characteristics of the devices, after post-hydrogenation, show average field effect mobilities > 100 cm2/Vs and better noise performance, if compared to conventional SPC-polysilicon TFTs. A main advantage of the presented technique is the reduced sensitivity of the device performances to the energy density used during ELA.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/177875
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