In this paper, circuital and planar electromagnetic simulations have been performed to model the microwave response of micromachined lumped elements by using commercial software packages. The modelling has been performed on realized and experimentally tested coplanar lumped elements and filters. The technology is based on micromachining of high resisitivity silicon wafers and GaAs, and the circuits were obtained on trilayer dielectric membranes and polymide membranes.

Micromachined coplanar microwave components: technology and modeling

R Marcelli;G Bartolucci
2001

Abstract

In this paper, circuital and planar electromagnetic simulations have been performed to model the microwave response of micromachined lumped elements by using commercial software packages. The modelling has been performed on realized and experimentally tested coplanar lumped elements and filters. The technology is based on micromachining of high resisitivity silicon wafers and GaAs, and the circuits were obtained on trilayer dielectric membranes and polymide membranes.
2001
Istituto per la Microelettronica e Microsistemi - IMM
RF MEMS
Microwaves
Lumped Components
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/198638
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