The wetting phenomena and adhesion between Ag-Cu-X molten alloys (where X is an active brazing element) and ceramic substrate ZrB2 have been investigated from the theoretical and experimental point of view. The wetting depends on the bonding characteristics of liquid alloys and ceramics as well as on the interactive force at the interface. The energetics of the bulk and the surface of Ag-Cu-X liquid alloys have been analysed in the frame of statistical mechanical model through the study of the concentration dependence of various properties such as surface tension, surface composition, concentration fluctuations in the long wavelength limit, Warren-Cowley chemical short range order parameter and diffusivity. Further, the calculated values of surface tension have been used to compute the work of adhesion and interfacial tension between solid substrate and liquid alloys over the whole concentration range.
Ag-Cu-X/ZrB2 system: wetting properties and interfacial adhesion
Novakovic R;Muolo ML;Passerone A
2002
Abstract
The wetting phenomena and adhesion between Ag-Cu-X molten alloys (where X is an active brazing element) and ceramic substrate ZrB2 have been investigated from the theoretical and experimental point of view. The wetting depends on the bonding characteristics of liquid alloys and ceramics as well as on the interactive force at the interface. The energetics of the bulk and the surface of Ag-Cu-X liquid alloys have been analysed in the frame of statistical mechanical model through the study of the concentration dependence of various properties such as surface tension, surface composition, concentration fluctuations in the long wavelength limit, Warren-Cowley chemical short range order parameter and diffusivity. Further, the calculated values of surface tension have been used to compute the work of adhesion and interfacial tension between solid substrate and liquid alloys over the whole concentration range.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.