A contactless, all-optical and non-destructive technique for simultaneous measurement of minority carrier recombination lifetime and surface recombination velocity, at low injection level, in silicon samples is presented. Being contactless and non-destructive with respect to the surface to be analysed, the method is appealing for routine lifetime characterisation.

Separation of bulk lifetime and surface recombination velocity by multiwavelength technique

Sirleto L;
2002

Abstract

A contactless, all-optical and non-destructive technique for simultaneous measurement of minority carrier recombination lifetime and surface recombination velocity, at low injection level, in silicon samples is presented. Being contactless and non-destructive with respect to the surface to be analysed, the method is appealing for routine lifetime characterisation.
2002
Istituto per la Microelettronica e Microsistemi - IMM
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/205726
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