The segregation of Sn in Cu and the formation of a Sn-Cu surface alloy has been studied by Auger electron spectroscopy (AES), reflection high-energy electron diffraction (RHEED) and scanning tunneling microscopy (STM). By annealing Cu(Sn) samples at T=500°C, we have found a Sn0.33Cu0.66 p(?3 × ?3)R30° reconstructed surface layer. By increasing T to 750°C, the tin concentration decreases up to 0.20, while the reconstruction is maintained. Atomic-resolution STM images of this phase show no rippling, but several steps. The surface lattice parameters are 0.47±0.02 and 0.51±0.02 nm, respectively, along and across the steps. © 1998 Elsevier Science B.V. All rights reserved.

Formation of a two-dimensional alloy/surface phase: Auger and STM study of Cu(Sn)(111)

Contini;
1998

Abstract

The segregation of Sn in Cu and the formation of a Sn-Cu surface alloy has been studied by Auger electron spectroscopy (AES), reflection high-energy electron diffraction (RHEED) and scanning tunneling microscopy (STM). By annealing Cu(Sn) samples at T=500°C, we have found a Sn0.33Cu0.66 p(?3 × ?3)R30° reconstructed surface layer. By increasing T to 750°C, the tin concentration decreases up to 0.20, while the reconstruction is maintained. Atomic-resolution STM images of this phase show no rippling, but several steps. The surface lattice parameters are 0.47±0.02 and 0.51±0.02 nm, respectively, along and across the steps. © 1998 Elsevier Science B.V. All rights reserved.
1998
Annealing
Auger electron spectroscopy
Copper
Lattice constants
Reflection high energy electron diffraction
Scanning tunneling microscopy
Segregation (metallography)
Single crystals
Surface structure
Surface treatment
Tin
Tin alloys
Rippling
Single crystal surface
Surface segregation
Surface phenomena
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/210935
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