The paper illustrates the activity carried out under an ESA contract for the development of a miniaturized RF-MEMS SPDT switch and switch matrix using micromachining technology on a silicon substrate for power applications. A manufacturing procedure, based on an eight masks process, has been set up. At present, a broadband single-pole-double-throw (SPDT) switch operating in the 0-30 GHz frequency range has been fabricated and measured. Isolation of about -40 dB and insertion loss better than -0.7 dB have been obtained.

RF-MEMS SPDT Switch on Silicon Substrate for Space Applications

Romolo Marcelli;
2004

Abstract

The paper illustrates the activity carried out under an ESA contract for the development of a miniaturized RF-MEMS SPDT switch and switch matrix using micromachining technology on a silicon substrate for power applications. A manufacturing procedure, based on an eight masks process, has been set up. At present, a broadband single-pole-double-throw (SPDT) switch operating in the 0-30 GHz frequency range has been fabricated and measured. Isolation of about -40 dB and insertion loss better than -0.7 dB have been obtained.
2004
Istituto per la Microelettronica e Microsistemi - IMM
0-7803-8703-1
RF MEMS
SPDT
Micromachining
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/237976
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