Bulk and micromachined lumped elements have been designed and realized on silicon and GaAs wafers. S and Meander inductors, and interdigital capacitors with eight and sixteen fingers have been obtained. These components have been characterized up to 40 GHz by means of an on wafer measurement system. The modeling has been developed by using the commercial software package HP Microwave Design System (HP-MDS) to exploit the possibilities for the simulation of lumped components utilizing coupled line elements, right angle bends and tee-junctions
Modeling of Bulk and Micromachined Lumped Elements for Microwave and Millimeter Wave Frequencies
R Marcelli;G Bartolucci;
1999
Abstract
Bulk and micromachined lumped elements have been designed and realized on silicon and GaAs wafers. S and Meander inductors, and interdigital capacitors with eight and sixteen fingers have been obtained. These components have been characterized up to 40 GHz by means of an on wafer measurement system. The modeling has been developed by using the commercial software package HP Microwave Design System (HP-MDS) to exploit the possibilities for the simulation of lumped components utilizing coupled line elements, right angle bends and tee-junctionsFile in questo prodotto:
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