Atomic deuterium (D) interaction with the polar 3C-SiC(100) 3×2 surface is investigated by synchrotron radiation-based valence band and core level photoemission. D is found to induce metallization of the surface. The D atoms lead to a charge transfer into the topmost Si and C planes, with D atoms terminating top surface dangling bond and an asymmetric attack in the third Si plane. However, a significant isotopic effect is observed when compared to the H-induced metallization with amazingly smaller charge transfer suggesting dynamical effects.

Isotopic effect in deuterium-induced semiconductor surface metallization: D/3C-SiC(100) 3×2

Moras P;Crotti C;Perfetti P
2006

Abstract

Atomic deuterium (D) interaction with the polar 3C-SiC(100) 3×2 surface is investigated by synchrotron radiation-based valence band and core level photoemission. D is found to induce metallization of the surface. The D atoms lead to a charge transfer into the topmost Si and C planes, with D atoms terminating top surface dangling bond and an asymmetric attack in the third Si plane. However, a significant isotopic effect is observed when compared to the H-induced metallization with amazingly smaller charge transfer suggesting dynamical effects.
2006
Istituto di Struttura della Materia - ISM - Sede Roma Tor Vergata
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/25646
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