Silicon carbide whisker-silicon nitride matrix composites were hot pressed at 1750 °C and 30 MPa pressure for 1h. The effect of the addition of 20 and 30 vol. % of whiskers on densification behaviour, microstructural development, strength, fracture toughness, Young's modulus, microhardness and thermal expansion have been evaluated. Composition-processing-microstructure-prop­erties relationships are discussed.

Hot-pressed Si3N4-SiC Whisker Composites

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1989

Abstract

Silicon carbide whisker-silicon nitride matrix composites were hot pressed at 1750 °C and 30 MPa pressure for 1h. The effect of the addition of 20 and 30 vol. % of whiskers on densification behaviour, microstructural development, strength, fracture toughness, Young's modulus, microhardness and thermal expansion have been evaluated. Composition-processing-microstructure-prop­erties relationships are discussed.
1989
0-444-87318-X
Silicon Nitride
Silicon Carbide Whiskers
Silicon Nitride-Silicon Carbide Whiskers Composite
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/265330
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