The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelettronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers. © 2008 IEEE.

Preparation and thermal characterization of Carbon Nanotubes-based composites for applications in electronics packaging

Toschi Francesco;Toschi Francesco;
2008

Abstract

The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelettronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers. © 2008 IEEE.
2008
978-0-7695-3085-7
Carbon nanotubes
Epoxy resin
Nanocomposite
Thermal interface materials
Thermal management
TIM
File in questo prodotto:
Non ci sono file associati a questo prodotto.

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/302229
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 3
  • ???jsp.display-item.citation.isi??? ND
social impact