This paper describes a novel and easily manufacturable method for increasing the thermal resistance of microheaters fabricated on glass substrates, thus decreasing the thermal dissipation of the devices. An automatic sawing machine was exploited to dig 240 ?m wide trenches in order to thermally isolate the heater from the glass substrate and four different layouts of the trenches have been investigated. An improvement of the thermal resistance up to 217% on a heat sink and 30% in air has been obtained. The thermal capacitance was also considerably decreased, thus improving the dynamic thermal behavior.

Improvement of the thermal resistance of thin film heaters on glass substrate for lab-on-chip applications

Zampolli S;
2014

Abstract

This paper describes a novel and easily manufacturable method for increasing the thermal resistance of microheaters fabricated on glass substrates, thus decreasing the thermal dissipation of the devices. An automatic sawing machine was exploited to dig 240 ?m wide trenches in order to thermally isolate the heater from the glass substrate and four different layouts of the trenches have been investigated. An improvement of the thermal resistance up to 217% on a heat sink and 30% in air has been obtained. The thermal capacitance was also considerably decreased, thus improving the dynamic thermal behavior.
2014
Inglese
Edited by Giorgio Sberveglieri and Vittorio Ferrari
EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers
EUROSENSORS 2014
87
959
962
http://www.scopus.com/record/display.url?eid=2-s2.0-84923335987&origin=inward
7-10/09/2014
Glass microfabrication
Lab-on-chip
Microheater
Micromashining
Thermal capacitance
Thermal resistance
Thermal time constant
Thin film heater on glass
8
none
Scorzoni, A; Tavernelli, M; Placidi, P; Valigi, P; Zampolli, S; Caputo, D; Petrucci, G; Nascetti, A
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/306334
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