Atomic Layer Deposition (ALD) is a vapor-phase thin-film deposition technique by which the film growth proceeds through sequential self-limiting surface reactions. Advantages: low temperature, high conformal coverage, large-area uniformity, accurate control of film thickness, accurate control of composition. Disadvantages: low growth-rate, film thickness less than 200 nm, films are often amorphous, low operating pressure. Two examples of ALD nanostructured oxidic films as functional coatings are presented in detail: 1)A high surface-to-volume ratio template for photovoltaic applications 2)A protective coating for metallic surfaces
Low- temperature Atomic Layer Deposition of nanostructured oxidic films as functional coatings
Gerbasi R;El Habra N;Visentin F;Galenda A;Crociani L
2015
Abstract
Atomic Layer Deposition (ALD) is a vapor-phase thin-film deposition technique by which the film growth proceeds through sequential self-limiting surface reactions. Advantages: low temperature, high conformal coverage, large-area uniformity, accurate control of film thickness, accurate control of composition. Disadvantages: low growth-rate, film thickness less than 200 nm, films are often amorphous, low operating pressure. Two examples of ALD nanostructured oxidic films as functional coatings are presented in detail: 1)A high surface-to-volume ratio template for photovoltaic applications 2)A protective coating for metallic surfacesFile in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
