Graphene and related materials can lead to disruptive advances in next-generation photonics and optoelectronics. The challenge is to devise growth, transfer and fabrication protocols providing high (>=5000 cm2 V-1 s-1) mobility devices with reliable performance at the wafer scale. Here, we present a flow for the integration of graphene in photonics circuits. This relies on chemical vapor deposition (CVD) of single layer graphene (SLG) matrices comprising up to ~12000 individual single crystals, grown to match the geometrical configuration of the devices in the photonic circuit. This is followed by a transfer approach which guarantees coverage over ~80% of the device area, and integrity for up to 150 mm wafers, with room temperature mobility ~5000 cm2 V-1 s-1. We use this process flow to demonstrate double SLG electro-absorption modulators with modulation efficiency ~0.25, 0.45, 0.75, 1 dB V-1 for device lengths ~30, 60, 90, 120 ?m. The data rate is up to 20 Gbps. Encapsulation with single-layer hexagonal boron nitride (hBN) is used to protect SLG during plasma-enhanced CVD of Si3N4, ensuring reproducible device performance. The processes are compatible with full automation. This paves the way for large scale production of graphenebased photonic devices.

Wafer-scale integration of graphene-based photonic devices

Pezzini S.;Marconi S.;Fabbri F.;
2021

Abstract

Graphene and related materials can lead to disruptive advances in next-generation photonics and optoelectronics. The challenge is to devise growth, transfer and fabrication protocols providing high (>=5000 cm2 V-1 s-1) mobility devices with reliable performance at the wafer scale. Here, we present a flow for the integration of graphene in photonics circuits. This relies on chemical vapor deposition (CVD) of single layer graphene (SLG) matrices comprising up to ~12000 individual single crystals, grown to match the geometrical configuration of the devices in the photonic circuit. This is followed by a transfer approach which guarantees coverage over ~80% of the device area, and integrity for up to 150 mm wafers, with room temperature mobility ~5000 cm2 V-1 s-1. We use this process flow to demonstrate double SLG electro-absorption modulators with modulation efficiency ~0.25, 0.45, 0.75, 1 dB V-1 for device lengths ~30, 60, 90, 120 ?m. The data rate is up to 20 Gbps. Encapsulation with single-layer hexagonal boron nitride (hBN) is used to protect SLG during plasma-enhanced CVD of Si3N4, ensuring reproducible device performance. The processes are compatible with full automation. This paves the way for large scale production of graphenebased photonic devices.
2021
Istituto Nanoscienze - NANO
Inglese
15
2
3171
3187
17
https://pubs.acs.org/doi/10.1021/acsnano.0c09758
Sì, ma tipo non specificato
graphene
photonics
wafer scale
modulators
integration
encapsulation
Internazionale
10
info:eu-repo/semantics/article
262
Giambra, M. A.; Miseikis, V.; Pezzini, S.; Marconi, S.; Montanaro, A.; Fabbri, F.; Sorianello, V.; Ferrari, A. C.; Coletti, C.; Romagnoli, M.
01 Contributo su Rivista::01.01 Articolo in rivista
open
   Graphene Flagship Core Project 2
   GrapheneCore2
   European Commission
   Horizon 2020 Framework Programme
   785219

   Graphene Flagship Core Project 3
   GrapheneCore3
   European Commission
   Horizon 2020 Framework Programme
   881603
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/394975
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