This paper reports on the preparation procedure of 3D screen printed RF copper components which were (i) printed in stainless steel and subsequently copper plated, and (ii) printed directly in copper. The RF properties were measured and showed promising results for insertion loss and reflection coefficient.

Preparation and Properties of 3D Screen-Printed RF Components

O Peverini;G Addamo;
2019

Abstract

This paper reports on the preparation procedure of 3D screen printed RF copper components which were (i) printed in stainless steel and subsequently copper plated, and (ii) printed directly in copper. The RF properties were measured and showed promising results for insertion loss and reflection coefficient.
2019
Istituto di Elettronica e di Ingegneria dell'Informazione e delle Telecomunicazioni - IEIIT
Inglese
2019 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
Sì, ma tipo non specificato
16-18/7/2019
Bochum, Germany, Germany
filters
electronic equipment manufacture
6
none
Dressler, M; Studnitzky, T; Stäter, M; Peverini, O; Addamo, G; Nickel, Hu
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/411739
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