Thin-film deposition: Physical techniques

The quality and the characteristics of the fabricated films are governed in PVD by numerous parameters, such as the deposition rate, substrate temperature, sub-strate materials and deposition atmosphere. In this chapter, we will first give a quick hint on the main PVD techniques and, then, a more detailed vision of the sputtering process without losing the generality of the presentation. Chapter Contents: • 7.1 Introduction • 7.2 Thermal processes • 7.2.1 Vacuum evaporation • 7.2.2 Pulsed laser deposition • 7.2.3 Molecular beam epitaxy • 7.3 Sputtering • 7.3.1 DC sputtering • 7.3.1.1 Cathode and anode sheaths • 7.3.1.2 DC discharge model • 7.3.2 RF sputtering • 7.3.2.1 RF discharge model • 7.3.2.2 Matching network • 7.3.2.3 Magnetron • 7.3.2.4 Control system of the thickness • 7.4 Conclusions • Acknowledgements • References.