Ceramic nanoparticles, i.e. SiO2, TiO2 and Al2O3, with increasingly high thermal conductivity represent good candidates to improve the thermophysical properties of epoxy resins. In the present paper, the influence of filler addition on thermal, mechanical and dielectric properties, have been investigated by means of Differential Scanning Calorimetry (DSC), Dynamic-mechanical analysis (DMA) and dielectric spectroscopy to measure the thermal conductivity, storage and loss modulus, dielectric permittivity, and volume resistivity. Moreover, morphological investigations by Scanning Electron Microscopy (SEM) have been performed to confirm the particle dispersion into the epoxy matrix. The results have shown that both elastic modulus and glass transition temperature Tg increase with particle content. An enhancement of thermal conductivity is also observed at high filler content due to the formation of heat conductive pathways within the matrix. The nanocomposites relative permittivity at 50 Hz is lower, while dielectric loss is slightly higher if compared with neat epoxy matrix. A decrease in relative permittivity with increasing frequency both for unfilled epoxy resin and epoxy nanocomposites has been observed.
Epoxy Nanocomposites with Ceramic Reinforcement for Electrical Insulation
E Amendola;
2011
Abstract
Ceramic nanoparticles, i.e. SiO2, TiO2 and Al2O3, with increasingly high thermal conductivity represent good candidates to improve the thermophysical properties of epoxy resins. In the present paper, the influence of filler addition on thermal, mechanical and dielectric properties, have been investigated by means of Differential Scanning Calorimetry (DSC), Dynamic-mechanical analysis (DMA) and dielectric spectroscopy to measure the thermal conductivity, storage and loss modulus, dielectric permittivity, and volume resistivity. Moreover, morphological investigations by Scanning Electron Microscopy (SEM) have been performed to confirm the particle dispersion into the epoxy matrix. The results have shown that both elastic modulus and glass transition temperature Tg increase with particle content. An enhancement of thermal conductivity is also observed at high filler content due to the formation of heat conductive pathways within the matrix. The nanocomposites relative permittivity at 50 Hz is lower, while dielectric loss is slightly higher if compared with neat epoxy matrix. A decrease in relative permittivity with increasing frequency both for unfilled epoxy resin and epoxy nanocomposites has been observed.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
