Microstructure Evolution and First-Order Reversal Curve Analysis of the Interphase Coupling in SmCo Thick Film

Thick SmCo films of 500 nm thickness were deposited by radio frequency sputtering in W/SmCo/W structures on a Si substrate. After annealing at 650–750 °C, the as-grown soft amorphous structure transforms into a mixture of crystalline Sm2Co17 and SmCo5 hard magnetic phases. Annealing at 650 °C leads to film crystallization with an average grain size of 64 nm, coercivity of 0.5 T, and remanence magnetization of about 0.5 T for a maximum applied field of 2 T. The remanence magnetization decreases by 20% upon annealing at 750 °C, whereas the average crystalline size and coercivity increase up to 73 nm and 1.1 T, respectively. Series of the first-order reversal curves recorded in the samples that were annealed at 650 °C and 750 °C demonstrate redistribution of the switching fields between the softer (Sm2Co17) and harder (SmCo5) phases, depending on the strength of interphase interaction. Overall, the higher remanence and sizable coercivity of films annealed at 650 °C make them good candidates for the fabrication of micromagnets to be integrated in microelectromechanical systems.