Gate oxide reliability of Power MOSFETs strongly depends on their defectiveness levels. Higher defectiveness levels could involve in higher gate leakage current, threshold voltage shift effects and lower oxide reliability. Therefore, it is important to evaluate gate oxide defectiveness. This paper estimates the different oxide defectiveness levels of two main topologies utilized in Low Voltage Power MOSFETs and it shows how the Trench compared to the Planar oxide shows higher defectiveness levels especially considering interface traps. © VDE VERLAG GMBH · Berlin · Offenbach.
Gate oxide defectiveness levels: An experimental comparison between Planar and trench low voltage power MOSFET technologies
Consentino G.
2013
Abstract
Gate oxide reliability of Power MOSFETs strongly depends on their defectiveness levels. Higher defectiveness levels could involve in higher gate leakage current, threshold voltage shift effects and lower oxide reliability. Therefore, it is important to evaluate gate oxide defectiveness. This paper estimates the different oxide defectiveness levels of two main topologies utilized in Low Voltage Power MOSFETs and it shows how the Trench compared to the Planar oxide shows higher defectiveness levels especially considering interface traps. © VDE VERLAG GMBH · Berlin · Offenbach.File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.


