Crack-templated thin films, inspired by naturally occurring patterns such as leaf venation, spider webs, and the networked structure of dried egg white, represent a paradigm shift in the design of functional materials. Traditionally, cracks in coatings are seen as defects to be avoided due to their potential to compromise mechanical integrity and performance. However, in this context, cracks are deliberately induced and meticulously controlled to serve as templates for versatile applications. This review explores the latest advances in preparation techniques, including solvent evaporation and thermal stress induction, with a focus on the interplay between material properties (e.g., polymers and ceramics) and process parameters (e.g., drying rates and temperature, layer thickness, substrate interactions) that govern crack behavior. The resulting crack patterns offer tunable features, such as density, width, shape, and orientation, which can be harnessed for applications in semitransparent electrodes, flexible sensors, and wearable and energy storage devices. Our study aims to navigate the advancements in crack engineering in the last 10 years and underscores its importance as a purposeful and versatile strategy for next-generation thin-film technologies, offering a novel and affordable approach to transforming perceived defects into assets for cutting-edge thin-film technologies.

Crack-Templated Patterns in Thin Films: Fabrication Techniques, Characterization, and Emerging Applications

Cama, Eleonora Sofia
Primo
;
Pasini, Mariacecilia
;
Giovanella, Umberto;Galeotti, Francesco
Ultimo
2025

Abstract

Crack-templated thin films, inspired by naturally occurring patterns such as leaf venation, spider webs, and the networked structure of dried egg white, represent a paradigm shift in the design of functional materials. Traditionally, cracks in coatings are seen as defects to be avoided due to their potential to compromise mechanical integrity and performance. However, in this context, cracks are deliberately induced and meticulously controlled to serve as templates for versatile applications. This review explores the latest advances in preparation techniques, including solvent evaporation and thermal stress induction, with a focus on the interplay between material properties (e.g., polymers and ceramics) and process parameters (e.g., drying rates and temperature, layer thickness, substrate interactions) that govern crack behavior. The resulting crack patterns offer tunable features, such as density, width, shape, and orientation, which can be harnessed for applications in semitransparent electrodes, flexible sensors, and wearable and energy storage devices. Our study aims to navigate the advancements in crack engineering in the last 10 years and underscores its importance as a purposeful and versatile strategy for next-generation thin-film technologies, offering a novel and affordable approach to transforming perceived defects into assets for cutting-edge thin-film technologies.
2025
Istituto di Scienze e Tecnologie Chimiche "Giulio Natta" - SCITEC
crack lithography
metal deposition
metal mesh
nanowires
residual stress
sol–gel
thickness
thin films
transparent conductive electrode
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/562727
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