We report on the growth and properties of SrRuO3 films for application as metal gates for CMOS devices. The films were grown at 500degreesC by metal-organic chemical vapour deposition on Si substrates with thermal SiO2, atomic-layer deposited Al2O3 and HfO2 dielectric films. The films exhibit room temperature resistivity below 1 mOmegacm. We have analysed the interface between the SrRuO3 metal gate and the oxide film by Rutherford backscattering and secondary ion mass spectroscopy. Annealing in an oxygen atmosphere and forming gas (90% N-2 + 10% H-2) were employed for testing the stability of the SrRuO3 metal gate. Finally, electrical characteristics of the metal gate stack were investigated by high-frequency capacitance-voltage measurements. The properties of metal-organic chemical vapour grown SrRuO3 gate electrode are analysed with regards to integration in CMOS devices.

Preparation of SrRuO3 films for advanced CMOS metal gates

Wiemer C;
2004

Abstract

We report on the growth and properties of SrRuO3 films for application as metal gates for CMOS devices. The films were grown at 500degreesC by metal-organic chemical vapour deposition on Si substrates with thermal SiO2, atomic-layer deposited Al2O3 and HfO2 dielectric films. The films exhibit room temperature resistivity below 1 mOmegacm. We have analysed the interface between the SrRuO3 metal gate and the oxide film by Rutherford backscattering and secondary ion mass spectroscopy. Annealing in an oxygen atmosphere and forming gas (90% N-2 + 10% H-2) were employed for testing the stability of the SrRuO3 metal gate. Finally, electrical characteristics of the metal gate stack were investigated by high-frequency capacitance-voltage measurements. The properties of metal-organic chemical vapour grown SrRuO3 gate electrode are analysed with regards to integration in CMOS devices.
2004
Istituto per la Microelettronica e Microsistemi - IMM
metal-organics chemical vapour deposition; CMOS technology; metal gates
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/9022
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