SPERA, MONIA
SPERA, MONIA
Active dopant profiling and Ohmic contacts behavior in degenerate n-type implanted silicon carbide
2020 Spera, Monia; Greco, Giuseppe; Severino, Andrea; Vivona, Marilena; Fiorenza, Patrick; Giannazzo, Filippo; Roccaforte, Fabrizio
Current transport mechanisms in au-free metallizations for cmos compatible gan hemt technology
2020 Roccaforte, F; Spera, M; Di Franco, S; Nigro, Rl; Fiorenza, P; Giannazzo, F; Iucolano, F; Greco, G
Barrier inhomogeneity in vertical Schottky diodes on free standing gallium nitride
2019 Roccaforte, F; Giannazzo, F; Alberti, A; Spera, M; Cannas, M; Cora, I; Pecz, B; Iucolano, F; Greco, G
Effect of high temperature annealing (T > 1650 degrees C) on the morphological and electrical properties of p-type implanted 4H-SiC layers
2019 Spera, M; Corso, D; Di Franco, S; Greco, G; Severino, A; Fiorenza, P; Giannazzo, F; Roccaforte, F
Fabrication and characterization of ohmic contacts to 3C-SiC layers grown on silicon
2019 Spera, M; Greco, G; Lo Nigro, R; Di Franco, S; Corso, D; Fiorenza, P; Giannazzo, F; Zielinski, M; La Via, F; Roccaforte, F
Metal/Semiconductor Barrier Properties of Non-Recessed Ti/Al/Ti and Ta/Al/Ta Ohmic Contacts on AlGaN/GaN Heterostructures
2019 Spera, Monia; Greco, Giuseppe; LO NIGRO, Raffaella; Scalese, Silvia; Bongiorno, Corrado; Cannas, Marco; Giannazzo, Filippo; Roccaforte, Fabrizio
Ohmic contacts on n-type and p-type cubic silicon carbide (3C-SiC) grown on silicon
2019 Spera, M. ,,; Greco, G. ; Lo Nigro, R. ; Bongiorno, C. ; Giannazzo, F. ; Zielinski, M. ; La Via, F. ; Roccaforte, F.
Ohmic Contacts on p-Type Al-Implanted 4H-SiC Layers after Different Post-Implantation Annealings
2019 Spera, Monia; Greco, Giuseppe; Corso, Domenico; Di Franco, Salvatore; Severino, Andrea; Messina, Angelo Alberto; Giannazzo, Filippo; Roccaforte, Fabrizio
Modification of the sheet resistance under Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructures
2018 M. Spera ,,; C. Miccoli ; R. Lo Nigro ; C. Bongiorno ; D. Corso ; S. Di Franco ; F. Iucolano ; F. Roccaforte ; G. Greco
| Titolo | Data di pubblicazione | Autore(i) | File |
|---|---|---|---|
| Active dopant profiling and Ohmic contacts behavior in degenerate n-type implanted silicon carbide | 1-gen-2020 | Spera, Monia; Greco, Giuseppe; Severino, Andrea; Vivona, Marilena; Fiorenza, Patrick; Giannazzo, Filippo; Roccaforte, Fabrizio | |
| Current transport mechanisms in au-free metallizations for cmos compatible gan hemt technology | 1-gen-2020 | Roccaforte, F; Spera, M; Di Franco, S; Nigro, Rl; Fiorenza, P; Giannazzo, F; Iucolano, F; Greco, G | |
| Barrier inhomogeneity in vertical Schottky diodes on free standing gallium nitride | 1-gen-2019 | Roccaforte, F; Giannazzo, F; Alberti, A; Spera, M; Cannas, M; Cora, I; Pecz, B; Iucolano, F; Greco, G | |
| Effect of high temperature annealing (T > 1650 degrees C) on the morphological and electrical properties of p-type implanted 4H-SiC layers | 1-gen-2019 | Spera, M; Corso, D; Di Franco, S; Greco, G; Severino, A; Fiorenza, P; Giannazzo, F; Roccaforte, F | |
| Fabrication and characterization of ohmic contacts to 3C-SiC layers grown on silicon | 1-gen-2019 | Spera, M; Greco, G; Lo Nigro, R; Di Franco, S; Corso, D; Fiorenza, P; Giannazzo, F; Zielinski, M; La Via, F; Roccaforte, F | |
| Metal/Semiconductor Barrier Properties of Non-Recessed Ti/Al/Ti and Ta/Al/Ta Ohmic Contacts on AlGaN/GaN Heterostructures | 1-gen-2019 | Spera, Monia; Greco, Giuseppe; LO NIGRO, Raffaella; Scalese, Silvia; Bongiorno, Corrado; Cannas, Marco; Giannazzo, Filippo; Roccaforte, Fabrizio | |
| Ohmic contacts on n-type and p-type cubic silicon carbide (3C-SiC) grown on silicon | 1-gen-2019 | Spera, M. ,,; Greco, G. ; Lo Nigro, R. ; Bongiorno, C. ; Giannazzo, F. ; Zielinski, M. ; La Via, F. ; Roccaforte, F. | |
| Ohmic Contacts on p-Type Al-Implanted 4H-SiC Layers after Different Post-Implantation Annealings | 1-gen-2019 | Spera, Monia; Greco, Giuseppe; Corso, Domenico; Di Franco, Salvatore; Severino, Andrea; Messina, Angelo Alberto; Giannazzo, Filippo; Roccaforte, Fabrizio | |
| Modification of the sheet resistance under Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructures | 1-gen-2018 | M. Spera ,,; C. Miccoli ; R. Lo Nigro ; C. Bongiorno ; D. Corso ; S. Di Franco ; F. Iucolano ; F. Roccaforte ; G. Greco |