This paper reports on the electrical activation and Ohmic contact properties on p-type Al-implanted silicon carbide (4H-SiC). In particular, the contacts were formed on 4H-SiC-implanted layers, subjected to three different post-implantation annealing processes, at 1675 degrees C, 1175 degrees C, and 1825 degrees C. Under these post-implantation annealing conditions, the electrical activation of the Al dopant species increased from 39% to 56%. The Ti/Al/Ni contacts showed an Ohmic behavior after annealing at 950 degrees C. The specific contact resistance rho(c) could be lowered by a factor of 2.6 with the increase of the post-implantation annealing temperature. The result can be useful for application in device fabrication. Moreover, the dependence of rho(c) on the active acceptor concentration followed the thermionic field emission model, with a barrier height of 0.63 eV.
Ohmic Contacts on p-Type Al-Implanted 4H-SiC Layers after Different Post-Implantation Annealings
Spera, Monia
;Greco, Giuseppe
;Corso, Domenico;Di Franco, Salvatore;Giannazzo, Filippo;Roccaforte, Fabrizio
2019
Abstract
This paper reports on the electrical activation and Ohmic contact properties on p-type Al-implanted silicon carbide (4H-SiC). In particular, the contacts were formed on 4H-SiC-implanted layers, subjected to three different post-implantation annealing processes, at 1675 degrees C, 1175 degrees C, and 1825 degrees C. Under these post-implantation annealing conditions, the electrical activation of the Al dopant species increased from 39% to 56%. The Ti/Al/Ni contacts showed an Ohmic behavior after annealing at 950 degrees C. The specific contact resistance rho(c) could be lowered by a factor of 2.6 with the increase of the post-implantation annealing temperature. The result can be useful for application in device fabrication. Moreover, the dependence of rho(c) on the active acceptor concentration followed the thermionic field emission model, with a barrier height of 0.63 eV.File | Dimensione | Formato | |
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Descrizione: Ohmic Contacts on p-Type Al-Implanted 4H-SiC Layers after Dierent Post-Implantation Annealings
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