Coplanar wave-guide grounded lines (CPWG) have been designed for being realized by micromachining of high resistivity silicon wafers. Actually, different configurations have been compared between them by changing the dimensions of micromachined via-holes, as well as their number and separation, to get the optimal electrical matching conditions for CPWG lines. Wide-band matching and low losses have been predicted up to 30 GHz, and preliminary experimental results about the technology have been obtained.

Low Design of Micromachined Coplanar Grounded Wave-Guides

A Lucibello;E Proietti;R Marcelli
2007

Abstract

Coplanar wave-guide grounded lines (CPWG) have been designed for being realized by micromachining of high resistivity silicon wafers. Actually, different configurations have been compared between them by changing the dimensions of micromachined via-holes, as well as their number and separation, to get the optimal electrical matching conditions for CPWG lines. Wide-band matching and low losses have been predicted up to 30 GHz, and preliminary experimental results about the technology have been obtained.
2007
Istituto per la Microelettronica e Microsistemi - IMM
Inglese
Editors: Dan Dascalu, General Chairman; Adrian Rusu, Technical Program Chair
Proceedings of the 2007 International Semiconducator Conference, IEEE CAS 2007
2007 International Semiconducator Conference, IEEE CAS 2007
271
274
4
978-1-4244-0847-4
CAS Office
Bucuresti
ROMANIA
Sì, ma tipo non specificato
October 15 - 17, 2007
Sinaia, Romania
RF MEMS
Coplanar Waveguides
3
none
G. De Angelis; A. Lucibello; E. Proietti; S. Catoni; R. Marcelli
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/208878
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