Two families of Al+ implanted vertical p(+)-i-n diodes that have been processed all by identical steps except the post implantation annealing one have been characterized with current voltage measurements from -100 to +5V at different temperatures. Analysis of the static forward current voltage characteristics shows two different ideality factor regions, which are distinct for each family. The reverse current voltage characteristics reveals corresponding two different activation energies. These are assumed to be correlated to the Z(1/2) defect for the one case and another one with an activation energy of 0.25eV.

Al+ implanted 4H-SiC p(+)-i-n diodes: Evidence for post-implantation-annealing dependent defect activation

Moscatelli F;Nipoti R
2014

Abstract

Two families of Al+ implanted vertical p(+)-i-n diodes that have been processed all by identical steps except the post implantation annealing one have been characterized with current voltage measurements from -100 to +5V at different temperatures. Analysis of the static forward current voltage characteristics shows two different ideality factor regions, which are distinct for each family. The reverse current voltage characteristics reveals corresponding two different activation energies. These are assumed to be correlated to the Z(1/2) defect for the one case and another one with an activation energy of 0.25eV.
2014
Istituto per la Microelettronica e Microsistemi - IMM
978-3-03835-010-1
implantation
PiN
annealing
IV
defect
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/262710
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