This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/?), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.

High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging

Belsito L;Ferri M;Mancarella F;Roncaglia A;A A;
2013

Abstract

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/?), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
2013
Istituto per la Microelettronica e Microsistemi - IMM
9781467359818
Compressive strain
Fabrication and characterizations
High sensitivity
Silicon on insulator
SOI technology
Strain sensors
Vacuum packaging
Very high resolution
Actuators
Crystal resonators
MEMS
Microsystems
Silicon on insulator technology
Solid-state sensors
Vacuum
Chip scale packages
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/272746
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