This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/?), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.

High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging

Belsito L;Ferri M;Mancarella F;Roncaglia A;A A;
2013

Abstract

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/?), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes.
2013
Istituto per la Microelettronica e Microsistemi - IMM
Inglese
17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
992
995
9781467359818
http://www.scopus.com/inward/record.url?eid=2-s2.0-84891697440&partnerID=40&md5=06fe8ba0bab6b2770d9accd8518292ad
Compressive strain
Fabrication and characterizations
High sensitivity
Silicon on insulator
SOI technology
Strain sensors
Vacuum packaging
Very high resolution
Actuators
Crystal resonators
MEMS
Microsystems
Silicon on insulator technology
Solid-state sensors
Vacuum
Chip scale packages
cited By 0; Conference of 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 ; Conference Date: 16 June 2013 Through 20 June 2013; Conference Code:101747
9
none
Belsito, L; Ferri, M; Mancarella, F; Roncaglia, A; Yan, J; Seshia, ; A, A; Soga, ; K,
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/272746
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