Simulations of hole injection and forward current-voltage characteristics of Al+ implanted 4H-SiC p-i-n diodes have been performed for different values of hole densities in the ion implanted anode and different thicknesses of the base. Both the parameters are more elevated for thinner base values because of a less effective recombination but identical injection and increase with the increasing of the anode hole density up saturate because of a reduced effective majority carrier density in the electrodes with respect to real majority carrier density values due to the 4H-SiC band gap shrinking up to an effective carrier saturation. For Al p-type doping of 4H-SiC simulations show effective carrier of few units 10(18) cm(-3) and saturation to 5 x 10(18) cm(-3) for real hole density >= 5 x 10(18) cm(-3). In Al+ implanted 4H-SiC such hole density values can be obtained for implanted Al concentration of about 2 x 10(20) cm(-3) and 1950 degrees C/5 min annealing.

Al+ Implanted Anode for 4H-SiC p-i-n Diodes

Nipoti R;Albonetti C;
2012

Abstract

Simulations of hole injection and forward current-voltage characteristics of Al+ implanted 4H-SiC p-i-n diodes have been performed for different values of hole densities in the ion implanted anode and different thicknesses of the base. Both the parameters are more elevated for thinner base values because of a less effective recombination but identical injection and increase with the increasing of the anode hole density up saturate because of a reduced effective majority carrier density in the electrodes with respect to real majority carrier density values due to the 4H-SiC band gap shrinking up to an effective carrier saturation. For Al p-type doping of 4H-SiC simulations show effective carrier of few units 10(18) cm(-3) and saturation to 5 x 10(18) cm(-3) for real hole density >= 5 x 10(18) cm(-3). In Al+ implanted 4H-SiC such hole density values can be obtained for implanted Al concentration of about 2 x 10(20) cm(-3) and 1950 degrees C/5 min annealing.
2012
Istituto per la Microelettronica e Microsistemi - IMM
Istituto per lo Studio dei Materiali Nanostrutturati - ISMN
Inglese
Shenai, K; Dudley, M; Ohtani, N; Bakowski, M; Garg, R
GALLIUM NITRIDE AND SILICON CARBIDE POWER TECHNOLOGIES 2
2nd Symposium on Gallium Nitride (GaN) and Silicon Carbide (SiC) Power Technologies as part of ECS Fall Meeting
50
391
397
7
978-1-60768-351-3
http://ecst.ecsdl.org/content/50/3/391.full.pdf+html
Sì, ma tipo non specificato
OCT 07-12, 2012
Honolulu, HI
wide band gap semiconductor device
p-i-n diode
ion implantation
4
none
Nipoti, R; Di Benedetto, L; Albonetti, C; Bellone, S
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/274900
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