In this work, thin film packages were developed for radio-frequency microelectromechanical system (RF MEMS) configurations. The fabricated packages are suspended membranes in the multilayer SixNyHz/aSi/SixNyHz on conductive coplanar lines of different length. Several geometric parameters of the membranes, which are the length, the curvature radius at the vertices of the rectangular base, the density and the diameter of holes, were also varied. The mechanical properties of the suspended membranes were investigated by surface profilometry as a function of the geometric parameters. Finally, the RF characterization was performed to evaluate the impact of the package on the coplanar line performance. Hence, the proposed study provides results of crucial importance for the application of thin-film suspended microstructures for the packaging of RF MEMS devices.
Wafer-level thin film micropackaging for RF MEMS applications
Persano A;Siciliano P;Quaranta F;Lucibello A;Marcelli R;Capoccia G;Proietti E;
2016
Abstract
In this work, thin film packages were developed for radio-frequency microelectromechanical system (RF MEMS) configurations. The fabricated packages are suspended membranes in the multilayer SixNyHz/aSi/SixNyHz on conductive coplanar lines of different length. Several geometric parameters of the membranes, which are the length, the curvature radius at the vertices of the rectangular base, the density and the diameter of holes, were also varied. The mechanical properties of the suspended membranes were investigated by surface profilometry as a function of the geometric parameters. Finally, the RF characterization was performed to evaluate the impact of the package on the coplanar line performance. Hence, the proposed study provides results of crucial importance for the application of thin-film suspended microstructures for the packaging of RF MEMS devices.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
