Due to its excellent electrical and physical properties, silicon carbide can represent a good alternative to Si in applications like the inner tracking detectors of particle physics experiments (RD50, LHCC 2002-2003, 15 February 2002, CERN, Ginevra). In this work p(+)/n SiC diodes realised on a medium-doped (1 X 10(15) cm(-3)), 40 mu m thick epitaxial layer are exploited as detectors and measurements of their charge collection properties under beta particle radiation from a Sr-90 source are presented. Preliminary results up to 900 V reverse bias voltage show a good collection efficiency of 1700e(-) and a collection length (ratio between collected charge and generated e-h pairs/mu m) equal to the estimated width of the depleted region. Preliminary simulations on Schottky diodes have been carried out using the ISE-TCAD DESSIS simulation tool. Experimental results were reproduced well.

Measurements and simulations of charge collection efficiency of p(+)/n junction SiC detectors

Moscatelli F;Scorzoni A;Nipoti R
2005

Abstract

Due to its excellent electrical and physical properties, silicon carbide can represent a good alternative to Si in applications like the inner tracking detectors of particle physics experiments (RD50, LHCC 2002-2003, 15 February 2002, CERN, Ginevra). In this work p(+)/n SiC diodes realised on a medium-doped (1 X 10(15) cm(-3)), 40 mu m thick epitaxial layer are exploited as detectors and measurements of their charge collection properties under beta particle radiation from a Sr-90 source are presented. Preliminary results up to 900 V reverse bias voltage show a good collection efficiency of 1700e(-) and a collection length (ratio between collected charge and generated e-h pairs/mu m) equal to the estimated width of the depleted region. Preliminary simulations on Schottky diodes have been carried out using the ISE-TCAD DESSIS simulation tool. Experimental results were reproduced well.
2005
Istituto per la Microelettronica e Microsistemi - IMM
Silicon carbide
Detectors
p+/n junctions
Charge collection efficiency
Device simulations
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/41632
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