This study shows that, after annealing at 1950°C, a 1×1020 cm Al implanted 4H-SiC material shows a decreasing resistivity with increasing annealing time in the range 5-25 min. After this, the resistivity remains constant up to an annealing time of 40 min. The estimated minimum time to gain the thermal equilibrium in this implanted material at 1950°C is 12 min. Electrical characterization has been performed in the 20-680 K temperature range.

1950°C annealing of Al+ implanted 4H-SiC: Sheet resistance dependence on the annealing time

Nipoti Roberta;Centurioni Emanuele;
2016

Abstract

This study shows that, after annealing at 1950°C, a 1×1020 cm Al implanted 4H-SiC material shows a decreasing resistivity with increasing annealing time in the range 5-25 min. After this, the resistivity remains constant up to an annealing time of 40 min. The estimated minimum time to gain the thermal equilibrium in this implanted material at 1950°C is 12 min. Electrical characterization has been performed in the 20-680 K temperature range.
2016
Istituto per la Microelettronica e Microsistemi - IMM
9783035710427
4H-SiC
Al doping by ion implantation
Post implantation annealing time
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/428045
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