This study shows that, after annealing at 1950°C, a 1×1020 cm Al implanted 4H-SiC material shows a decreasing resistivity with increasing annealing time in the range 5-25 min. After this, the resistivity remains constant up to an annealing time of 40 min. The estimated minimum time to gain the thermal equilibrium in this implanted material at 1950°C is 12 min. Electrical characterization has been performed in the 20-680 K temperature range.

1950°C annealing of Al+ implanted 4H-SiC: Sheet resistance dependence on the annealing time

Nipoti Roberta;Centurioni Emanuele;
2016

Abstract

This study shows that, after annealing at 1950°C, a 1×1020 cm Al implanted 4H-SiC material shows a decreasing resistivity with increasing annealing time in the range 5-25 min. After this, the resistivity remains constant up to an annealing time of 40 min. The estimated minimum time to gain the thermal equilibrium in this implanted material at 1950°C is 12 min. Electrical characterization has been performed in the 20-680 K temperature range.
2016
Istituto per la Microelettronica e Microsistemi - IMM
Inglese
International Conference on Silicon Carbide and Related Materials 2015 (ICSCRM2015)
858
523
526
9783035710427
http://www.scopus.com/record/display.url?eid=2-s2.0-84971519435&origin=inward
Sì, ma tipo non specificato
04/10/2015-09/10/2015
Giardini Naxos (CT), Italy
4H-SiC
Al doping by ion implantation
Post implantation annealing time
1
none
Nipoti, Roberta; Parisini, Antonella; Vantaggio, Salvatore; Alfieri, Giovanni; Carnera, Alberto; Centurioni, Emanuele; Elmi, Ivan; Grossner, Ulrike...espandi
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/428045
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