An ultra-high-temperature HfB2-SiC composite was successfully consolidated by spark plasma sintering. The powder mixture of HfB2 + 30 vol.% beta-SiC was brought to full density without any deliberate addition of sintering aids, and applying the following conditions: 2100°C peak temperature, 100°C min-1 heating rate, 2 min dwell time, and 30 MPa applied pressure. The microstructure consisted of regular diboride grains (2 um size) and SiC particulates evenly distributed intergranularly. The only secondary phase was monoclinic HfO2. The incorporated SiC particulates played a key role in enhancing the sinterability of HfB2. Flexural strength at 25°C and 1500°C in ambient air was 590±50 and 600±15 MPa, respectively. Fracture toughness at room temperature (RT) (3.9±0.3 MPa?m) did not decrease at 1500 oC (4.0±0.1 MPa?m). Grain boundaries depletedof secondary phases were fundamental for the retention of strength and fracture toughness at high temperature. The thermal shock resistance, evaluated through the water-quenching method, was 500°C.
Microstructure and mechanical properties of an HfB2 + 30 vol.% SiC composite consolidated by spark plasma sintering
Frederic Tullio Monteverde
Primo
Writing – Original Draft Preparation
;Cesare Melandri;Stefano Guicciardi
2006
Abstract
An ultra-high-temperature HfB2-SiC composite was successfully consolidated by spark plasma sintering. The powder mixture of HfB2 + 30 vol.% beta-SiC was brought to full density without any deliberate addition of sintering aids, and applying the following conditions: 2100°C peak temperature, 100°C min-1 heating rate, 2 min dwell time, and 30 MPa applied pressure. The microstructure consisted of regular diboride grains (2 um size) and SiC particulates evenly distributed intergranularly. The only secondary phase was monoclinic HfO2. The incorporated SiC particulates played a key role in enhancing the sinterability of HfB2. Flexural strength at 25°C and 1500°C in ambient air was 590±50 and 600±15 MPa, respectively. Fracture toughness at room temperature (RT) (3.9±0.3 MPa?m) did not decrease at 1500 oC (4.0±0.1 MPa?m). Grain boundaries depletedof secondary phases were fundamental for the retention of strength and fracture toughness at high temperature. The thermal shock resistance, evaluated through the water-quenching method, was 500°C.File | Dimensione | Formato | |
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