When a Ta layer is deposited at the Si/Ti interface a new phase has been detected, i.e. the TiSi2 C40. The C40-C54 transformation kinetics and the film morphology are consistent with an increase of the nucleation density with respect to the C49-C54 transition. The activation energies for the nucleation rate (4.2±0.3 eV) and the growth velocity (4.0±0.4 eV) have been obtained from the in situ sheet resistance and the Transmission Electron Microscopy results. These results show that the process with a Ta layer at the Ti/Si interface has a greater scalability with respect to the standard TiSi2 process.

Effects of a Ta interlayer on the titanium silicide reaction: C40 formation and higher scalability of the TiSi2 process

La Via F;Privitera S;
2001

Abstract

When a Ta layer is deposited at the Si/Ti interface a new phase has been detected, i.e. the TiSi2 C40. The C40-C54 transformation kinetics and the film morphology are consistent with an increase of the nucleation density with respect to the C49-C54 transition. The activation energies for the nucleation rate (4.2±0.3 eV) and the growth velocity (4.0±0.4 eV) have been obtained from the in situ sheet resistance and the Transmission Electron Microscopy results. These results show that the process with a Ta layer at the Ti/Si interface has a greater scalability with respect to the standard TiSi2 process.
2001
Istituto per la Microelettronica e Microsistemi - IMM
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/116122
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