The two dimensional (2D) diffusion of self- interstitials (I) in crystalline Si, both at room temperature and at 800 degreesC, has been studied by quantitative SCM measurements. The 2D I emission from a I source laterally confined down to sub-micron dimensions, obtained by low-energy implantation through a patterned oxide mask, has been observed. At room temperature, I diffusion was monitored by measuring the electrical deactivation of B corresponding to the diffusing interstitial tail and it was demonstrated that this deactivation is due to compensating levels introduced by defects in the Si bandgap. At 800 degreesC I diffusion was monitored by measuring the transient enhanced diffusion of B spikes due to interstitial supersaturation produced during the annealing. In both cases, a dependence of the I depth- penetration on the original source size has been shown for mesoscopic window opening; (from 0.5 to 3 mum).

Two dimensional interstitial diffusion in mesoscopic structures

F Giannazzo;S Mirabella;E Napolitani;
2004

Abstract

The two dimensional (2D) diffusion of self- interstitials (I) in crystalline Si, both at room temperature and at 800 degreesC, has been studied by quantitative SCM measurements. The 2D I emission from a I source laterally confined down to sub-micron dimensions, obtained by low-energy implantation through a patterned oxide mask, has been observed. At room temperature, I diffusion was monitored by measuring the electrical deactivation of B corresponding to the diffusing interstitial tail and it was demonstrated that this deactivation is due to compensating levels introduced by defects in the Si bandgap. At 800 degreesC I diffusion was monitored by measuring the transient enhanced diffusion of B spikes due to interstitial supersaturation produced during the annealing. In both cases, a dependence of the I depth- penetration on the original source size has been shown for mesoscopic window opening; (from 0.5 to 3 mum).
2004
Istituto per la Microelettronica e Microsistemi - IMM
INFM
Inglese
Richter, H; Kittler, M
GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY
10th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2003)
95-96
351
359
9
3-908450-82-9
TRANS TECH-SCITEC PUBLICATIONS LTD
UETIKON
SVIZZERA
Sì, ma tipo non specificato
SEP 21-26, 2003
BERLIN, GERMANY
SCANNING CAPACITANCE MICROSCOPY
ENERGY-B IMPLANTS
DOPANT DIFFUSION
SILICON
SI
6
none
Giannazzo, F; Raineri, V; Mirabella, S; De Salvador, D; Napolitani, E; Priolo, F
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/118078
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