In this work, we investigate the effect of performing a high dose 20 keV He+ implant before the implantation of B at low energy (3 keV) in silicon and the subsequent thermal annealing at 800 degrees C. The implants were performed in laterally confined regions defined by opening windows in a SiO2 mask, in order to evidence the impact on a realistic configuration used in device fabrication. High resolution quantitative scanning capacitance microscopy (SCM) combined with cross-section transmission electron microscopy (XTEM) allowed to clarify the role of the voids distribution produced during the thermal annealing on the diffusion and electrical activation of implanted B in Si. Particular evidence was given to the effect of the uniform nanovoids distribution, which forms in the region between the surface and the buried cavity layer.

Effect of self-interstitials - nanovoids interaction on two-dimensional diffusion and activation of implanted B in Si

F Giannazzo;S Mirabella;G Impellizzeri;E Napolitani;
2005

Abstract

In this work, we investigate the effect of performing a high dose 20 keV He+ implant before the implantation of B at low energy (3 keV) in silicon and the subsequent thermal annealing at 800 degrees C. The implants were performed in laterally confined regions defined by opening windows in a SiO2 mask, in order to evidence the impact on a realistic configuration used in device fabrication. High resolution quantitative scanning capacitance microscopy (SCM) combined with cross-section transmission electron microscopy (XTEM) allowed to clarify the role of the voids distribution produced during the thermal annealing on the diffusion and electrical activation of implanted B in Si. Particular evidence was given to the effect of the uniform nanovoids distribution, which forms in the region between the surface and the buried cavity layer.
2005
Istituto per la Microelettronica e Microsistemi - IMM
INFM
Inglese
Pichaud, B; Claverie, A; Alquier, D; Richter, H; Kittler, M
GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY XI
11th International Autumn Meeting on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2005)
108-109
395
399
5
3-908451-13-2
Trans Tech Publications Ltd.
Stafa-Zurich
SWAZILAND
Sì, ma tipo non specificato
SEP 25-30, 2005
Giens, FRANCE
SCANNING CAPACITANCE MICROSCOPY
HELIUM IMPLANTATION
SILICON
DISSOLUTION
VOIDS
4
none
F Giannazzo; E Bruno; S Mirabella; G Impellizzeri; E Napolitani; V Raineri; F Priolo; D Alquier;
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/122062
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