In this work we compare simulations of SCM measurements on bevelled and micro-sectioned samples for investigating the impact of the carrier spilling effect. Simulation results are validated by experimental data obtained from dedicated samples calibrated by spreading resistance profiling. We show that 3D-based direct inversion of data measured on micro-sectioned bipolar samples results into a good quantitative agreement with the experimental spreading resistance profile in the area where carrier spilling is negligible. 2D-based simulations of bevelled bipolar samples reproduce qualitatively the measured SCM profiles. These results lead to the conclusion that also in the case of SCM, the lateral resolution in junction delineation can be improved by characterizing bevelled samples.

Simulation of scanning capacitance microscopy measurements on micro-sectioned and bevelled n(+)-p samples

Giannazzo F;Raineri V
2001

Abstract

In this work we compare simulations of SCM measurements on bevelled and micro-sectioned samples for investigating the impact of the carrier spilling effect. Simulation results are validated by experimental data obtained from dedicated samples calibrated by spreading resistance profiling. We show that 3D-based direct inversion of data measured on micro-sectioned bipolar samples results into a good quantitative agreement with the experimental spreading resistance profile in the area where carrier spilling is negligible. 2D-based simulations of bevelled bipolar samples reproduce qualitatively the measured SCM profiles. These results lead to the conclusion that also in the case of SCM, the lateral resolution in junction delineation can be improved by characterizing bevelled samples.
2001
Istituto per la Microelettronica e Microsistemi - IMM
SCM
device simulation
carrier spilling
dopant profiling techniques
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/45540
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