In this work the carbon ability to stop Si-interstitials is investigated in detail. We show that a Si1-yCy layer (y = 0.01 - 0.1 %) located between an interstitial source (produced near the surface by a Si 20 keV implant) and a deep B spike, can intercept the interstitial wind, behaving as a membrane, and can suppress the expected transient enhanced diffusion (TED) in the B spike. In particular, this trapping mechanism is studied as a function of the total carbon dose, and it is shown that a carbon dose equal to the implant dose is able to stop the self-interstitials and suppress the B-TED totally. These results suggest a one-one interaction between the carbon and the self-interstitial in the trapping mechanism. Moreover, experimental evidence for carbon clustering is reported when carbon atoms have trapped Si-interstitials. Finally, an application for the ultra-shallow junctions fabrication is shown, in which a Si1-yCy layer prevents the B-TED due to the backflow of interstitials from the end of range damage in a preamorphized B-implanted silicon sample.

Suppression of boron transient enhanced diffusion by C trapping

Mirabella S;Scalese S;Napolitani E;
2002

Abstract

In this work the carbon ability to stop Si-interstitials is investigated in detail. We show that a Si1-yCy layer (y = 0.01 - 0.1 %) located between an interstitial source (produced near the surface by a Si 20 keV implant) and a deep B spike, can intercept the interstitial wind, behaving as a membrane, and can suppress the expected transient enhanced diffusion (TED) in the B spike. In particular, this trapping mechanism is studied as a function of the total carbon dose, and it is shown that a carbon dose equal to the implant dose is able to stop the self-interstitials and suppress the B-TED totally. These results suggest a one-one interaction between the carbon and the self-interstitial in the trapping mechanism. Moreover, experimental evidence for carbon clustering is reported when carbon atoms have trapped Si-interstitials. Finally, an application for the ultra-shallow junctions fabrication is shown, in which a Si1-yCy layer prevents the B-TED due to the backflow of interstitials from the end of range damage in a preamorphized B-implanted silicon sample.
2002
Istituto per la Microelettronica e Microsistemi - IMM
INFM
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/52527
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