Very-high-frequency plasma enhanced chemical vapor deposition was used to fabricate microcrystalline silicon p-i-n photodetectors. Optical simulation of reflectance measurements was used to monitor the crystalline fraction, which determines the quantum efficiency in the near infrared range, relevant for telecommunication applications. To improve the i/p interface quality, a variable silane concentration was used in the early stages of the i-layer deposition. It is observed that a 50% large-grain fraction in the initial (200 nm) region of the i-layer results in a microcrystalline material well beyond the transition region between the amorphous and microcrystalline phase. The large-grain concentration in such initial layer is correlated with the open circuit voltage of the final p-i-n device. We suggest that the total elimination of the amorphous component in the heterophase transition region would result in excessive crystallization of the i-layer in the p-i-n device, which is to be technologically hindered by an on-time modulation of the deposition parameters.

Microcrystalline silicon p-i-n photodetectors for telecommunications and photovoltaic applications

C Summonte;R Rizzoli;E Centurioni;L De Stefano;I Rendina
2003

Abstract

Very-high-frequency plasma enhanced chemical vapor deposition was used to fabricate microcrystalline silicon p-i-n photodetectors. Optical simulation of reflectance measurements was used to monitor the crystalline fraction, which determines the quantum efficiency in the near infrared range, relevant for telecommunication applications. To improve the i/p interface quality, a variable silane concentration was used in the early stages of the i-layer deposition. It is observed that a 50% large-grain fraction in the initial (200 nm) region of the i-layer results in a microcrystalline material well beyond the transition region between the amorphous and microcrystalline phase. The large-grain concentration in such initial layer is correlated with the open circuit voltage of the final p-i-n device. We suggest that the total elimination of the amorphous component in the heterophase transition region would result in excessive crystallization of the i-layer in the p-i-n device, which is to be technologically hindered by an on-time modulation of the deposition parameters.
2003
Istituto per la Microelettronica e Microsistemi - IMM
Inglese
338-840
784
787
4
http://www.scopus.com/record/display.url?eid=2-s2.0-2942594076&origin=resultslist&sort=plf-f&src=s&st1=10.1016%2fj.jnoncrysol.2004.03.091&st2=&sid=41C4603CBFA3EC3D93255FC95931FCA7.FZg2ODcJC9ArCe8WOZPvA%3a10&sot=b&sdt=b&sl=37&s=DOI%2810.1016%2fj.jnoncrysol.2004.03.091%29&relpos=0&relpos=0&citeCnt=1&searchTerm=DOI%2810.1016%2Fj.jnoncrysol.2004.03.091%29
Sì, ma tipo non specificato
Computer simulation; Crystal structure; Crystallization; Energy gap; Light scattering; Plasma enhanced chemical vapor deposition; Reflection; Silicon; Telecommunication systems
Crystalline fractions; Photodetectors
4
info:eu-repo/semantics/article
262
C. Summonte; R. Rizzoli; E. Centurioni; D. Iencinella; L. Moretti; L. De Stefano; I. Rendina;
01 Contributo su Rivista::01.01 Articolo in rivista
none
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/97933
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