In this article we compare the strain distribution observed in 3C-SiC/Si(100) cantilevers, using the shift of the transverse optical (TO) mode in micro-Raman maps, with the values predicted using a recent analytic theory [1]. By taking advantage of an under etching of the microstructures during the fabrication processes, that removes a thin layer of highly defective SiC close to the film/substrate interface near the edges of the microstructures, we show that the variation of the experimental measured strain can be ascribed to a non-linearity of the strain field along the 3C-SiC film thickness.

Strain field analysis of 3C-SiC free-standing microstructures by micro-Raman and theoretical modelling

Piluso N;Anzalone R;La Magna A;La Via;
2012

Abstract

In this article we compare the strain distribution observed in 3C-SiC/Si(100) cantilevers, using the shift of the transverse optical (TO) mode in micro-Raman maps, with the values predicted using a recent analytic theory [1]. By taking advantage of an under etching of the microstructures during the fabrication processes, that removes a thin layer of highly defective SiC close to the film/substrate interface near the edges of the microstructures, we show that the variation of the experimental measured strain can be ascribed to a non-linearity of the strain field along the 3C-SiC film thickness.
2012
Istituto per la Microelettronica e Microsistemi - IMM
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/174015
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