Analysis of the Electron Traps at the 4H-SiC/SiO(2) Interface of a Gate Oxide Obtained by Wet Oxidation of a Nitrogen pre-Implanted Layer

This work is focusing oil the effect of a high concentration of nitrogen (N) introduced by ion implantation at the SiO(2)/4H-SiC interface in MOS capacitors. The N implanted sample (N(interface) similar to 1 x 10(19) cm(-3)) is compared with a non-implanted one (N(interface) similar to 1 x 10(16) cm(-3)) by means of the electron interface trap density (D(it)). The Dit is determined via High-Low frequency C-V method and Thermal Dielectric Relaxation Current (TDRC) technique. It is shown that the TDRC method, mainly used so far for determination of near interface oxide charges, call be exploited to gain information about the D(it) too. The determined value of D(it) in the N-implanted sample is nearly one order of magnitude lower than that in the sample without N implantation. Good agreement between the TDRC results and those obtained from High-Low frequency C-V measurements is obtained. Furthermore, the TDRC method shows a high accuracy and resolution of D(it),evaluation in the region close to the majority carrier band edge and gives information about the traps located into the oxide.