Analysis of electron traps at the 4H-SiC/SiO2 interface; influence by nitrogen implantation prior to wet oxidation

Electron states at the SiO2/4H-SiC interface have been investigated using capacitor structures and especially, the influence of excess nitrogen, introduced by ion implantation, at the interface is studied in detail. Implanted and nonimplanted n-type samples with an interfacial concentration of nitrogen of similar to 10(19) cm(-3) and 10(16) cm(-3), respectively, were analyzed by capacitance-voltage (C-V) measurements, performed at different temperatures and probe frequencies, and thermal dielectric relaxation current (TDRC) measurements performed in the temperature range of 35-295 K. Three main categories of electron states are disclosed, true interface states (D-it), fast near interface states (NIToxfast) and slow near interface states (NIToxslow). The density versus energy distributions of D-it and NIToxfast have been deduced from the TDRC data and they are shown to give a close quantitative agreement with the shape and frequency dependence of the C-V curves. Further, the amount of NIToxslow extracted from TDRC is demonstrated to be responsible for the parallel shifts and hysterezis effects occurring in the C-V characteristics. All three categories of electron states are reduced in concentration in the implanted samples. This holds particularly for NIToxfast with a peak at similar to 0.1 eV below the conduction band edge of 4H-SiC that is suppressed by at least two orders of magnitude relative to the nonimplanted samples. The decrease for D-it is also substantial (a factor of similar to 10) while the loss for NIToxslow is considerably smaller (only similar to 30%). The results provide firm evidence that NIToxfast and NIToxslow do not originate from the same kind of defect center.