This work presents the growth of ? SiC on silicon by VPE performed in a home built, horizontal, cold wall reactor. Test structures used to assess the stresses in the film were obtained either by an etch through the wafer from the bottom side of the wafer to produce membranes or an attack from the front to reveal cantilevers. Membranes and cantilevers presented both compressive and tensile strain, depending on film thickness. Raman spectroscopy was used to study strain and defects.

Strain evaluation in SiC MEMS test structures

Bosi M;Attolini G;Watts B E;Frigeri C;Rossi F;Poggi A;Roncaglia A;Mancarella F;
2009

Abstract

This work presents the growth of ? SiC on silicon by VPE performed in a home built, horizontal, cold wall reactor. Test structures used to assess the stresses in the film were obtained either by an etch through the wafer from the bottom side of the wafer to produce membranes or an attack from the front to reveal cantilevers. Membranes and cantilevers presented both compressive and tensile strain, depending on film thickness. Raman spectroscopy was used to study strain and defects.
2009
Istituto dei Materiali per l'Elettronica ed il Magnetismo - IMEM
Inglese
E. Wuchina, E. Opila, J. Fergus, P. Masset, T. Markus, T. Maruyama, D. Shifler
High Temperature Corrosion and Materials Chemistry 8
EURO CVD 17 / CVD 17
1037
1037
9781566777452
http://ecst.ecsdl.org/content/25/8/1031
The Electrochemical Society
Pennington, New Jersey 08534-2839,
STATI UNITI D'AMERICA
Sì, ma tipo non specificato
4-9 Oct. 2009
Vienna
SiC
MEMS
stress
10
none
Bosi, M; Attolini, G; Watts, BERNARD ENRICO; Frigeri, C; Rossi, F; Poggi, A; Roncaglia, A; Mancarella, F; Martinez, O; Hortelano, V
273
info:eu-repo/semantics/conferenceObject
04 Contributo in convegno::04.01 Contributo in Atti di convegno
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.14243/81992
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